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Single-Chip Passive UHF RFID Tags and Readers
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Project Goal
The aim of this part of the project is the radio frequency identification (RFID) tag's packaging and assembly. Different packaging techniques for connecting the RFID chip to the antenna will be developed and evaluated. The long-term mechanical and electrical reliability will be investigated.
Project Description
In this project, the advanced chip-on-board or chip-on-flex technology will be developed to package the RFID chip with the antenna and the substrate. Three different implementations will be investigated, including wire-bonding, solder-bumping and anisotropic conductive adhesive or film. Besides process development, the reliability issue of chip-on-board RFID packaging will be addressed. Reliability tests will be performed to evaluate the reliability performance of these packaging methods.
Faculty
Prof. Philip Ching-Ho CHAN ( �� �� �� )
Prof. Matthew Yuen ( �K �� �� )
Research Assistant
Bo GAO ( �� �� )
Jingfeng GONG ( �� �l �p )
Kit Ying WONG
Tracking Record and Accomplishment
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Stage |
Milestone |
Status |
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Phase I |
Analysis and characterization of commercial RFID tag packaging and assembly
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Accomplished |
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Phase II |
Development of chip-on-board using bondwire |
Accomplished |
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Phase III |
Antenna printing on flexible substrate using paste screen-printing |
Undergoing |
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Phase IV |
Bumping of RFID tag chips; Assembly of RFID chip and antenna using flip-chip on flex technology |
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Phase V |
Development of lamination assembly process, Encapsulation of RFID tag chips for chip protection |
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Phase VI |
Mechanical and electrical reliability characterization |
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